Reducing Write Latency of DDR5 Memory by Exploiting Bank-Parallelism” was published by Georgia Tech. Abstract “This paper studies the impact of DRAM writes on DDR5-based system. To efficiently perform ...
Why it's essential to combine sign-off accuracy, iterative feedback, and intelligent automation in complex designs.
Advanced packaging technologies are reshaping how compute platforms are conceived, optimized, and manufactured.
Designers are utilizing an array of programmable or configurable ICs to keep pace with rapidly changing technology and AI.
As chip designs become larger and more complex, especially for AI and high-performance computing workloads, it’s often not ...
In today’s fast-paced electronics design automation (EDA) environment, effective data management has become essential.
Ensuring that verification platforms can scale with industry demands and support new use cases as they emerge.
Thermal Modeling in Emerging Heterogeneous 2.5D/3D Systems (EPFL, Universidad Complutense de Madrid)
Accurate and efficient thermal modeling for 2.5D/3D heterogeneous chiplet systems” was published by researchers at EPFL and ...
Relying solely on end-of-line testing isn't enough when security, traceability, and mission reliability are vital.
Researchers from the University of Southern California Information Sciences Institute and the University of Wisconsin-Madison ...
A new technical paper titled “Advantage in distributed quantum computing with slow interconnects” was published by ...
Left-shifting DFT, scalable tests from manufacturing to the field, enabling system-level tests for in-field debug.
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