Abstract: IEC 61215 type approval testing has assisted in enhancing the overall durability of PV modules, but its design is better suited for moderate climates, as most known failure modes have been ...
Abstract: The die-attach layer is a vulnerable structure that is important to the reliability of an insulated-gate bipolar transistor (IGBT) module. A new failure mechanism named fatigue crack network ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results